Exposure apparatus for manufacturing semiconductor device,...

Details Exposure apparatus for manufacturing semiconductor device,... Exposure apparatus for manufacturing semiconductor device,...

2008-06-03

2008-06-03

Lee, Hwa S (Department: 2886)

Optics: measuring and testing

By light interference

For dimensional measurement

C356S508000

Reexamination Certificate

active

07382469

ABSTRACT:
Defects are prevented from occurring during an exposure process by detecting vibration of and measuring the relative position of components of the exposure apparatus. The exposure apparatus includes an external frame on which a reference mirror is disposed, a projection lens, a first mirror fixed relative to the projection lens, a wafer stage, a second mirror fixed relative to the wafer stage, and an interferometer system that detects vibration of the projection lens using the reference mirror and the first mirror and detects the position of the wafer stage relative to the projection lens using the first and second mirrors. A second interferometer system may be provided to detect vibration of the first interferometer system.

REFERENCES:
patent: 5798530 (1998-08-01), Okumura
patent: 5828573 (1998-10-01), Hayashi
patent: 6170622 (2001-01-01), Wakui et al.
patent: 6359688 (2002-03-01), Akimoto et al.
patent: 6392741 (2002-05-01), Mori et al.
patent: 0243316 (1997-09-01), None
patent: 11325821 (1999-11-01), None
patent: 1020020067658 (2002-08-01), None

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