Exposure apparatus

Photocopying – Projection printing and copying cameras – Identifying – composing – or selecting

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

355 53, 356401, G03B 2752, G03B 2742

Patent

active

050033425

ABSTRACT:
An exposure apparatus for exposing a semiconductor wafer to a reticle pattern has a projection lens, a wafer stage arranged to travel two-dimensionally in the focal plane of the projection lens, a first position-detecting system whose Abbe error is approximately zero with respect to any exposure position, and a second position-detecting system whose Abbe error is approximately zero with respect to any alignment position. The exposure apparatus is also provided with an off-axis alignment system for detecting a fiducial mark on the wafer stage, an on-axis alignment system for detecting a reticle mark and the fiducial mark, and a main controller. The main controller utilizes the off-axis and on-axis alignment systems to detect the position of the fiducial marks, determines a correction constant, and controls the position of the wafer stage on the basis of the correction constant and a position signal corresponding to the wafer stage. In the case of exposure, the first position-detecting system is selected, while the second position-detecting system is selected with respect to alignment.

REFERENCES:
patent: 4875076 (1989-10-01), Torigoe et al.
patent: 4958082 (1990-09-01), Makinouchi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Exposure apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Exposure apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Exposure apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-620692

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.