Evaluating a multi-layered structure for voids

Details Evaluating a multi-layered structure for voids Evaluating a multi-layered structure for voids

2005-04-26

2005-04-26

Rosenberger, Richard A. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Transparent or translucent material

C356S369000, C356S237400, C356S237500

Reexamination Certificate

active

06885444

ABSTRACT:
A method and apparatus measure properties of two layers of a damascene structure (e.g. a silicon wafer during fabrication), and use the two measurements to identify a location as having voids. The two measurements may be used in any manner, e.g. compared to one another, and voids are deemed to be present when the two measurements diverge from each other. In response to the detection of voids, a process parameter used in fabrication of the damascene structure may be changed, to reduce or eliminate voids in to-be-formed structures.

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