Etching solution for copper or copper alloy

Details Etching solution for copper or copper alloy Etching solution for copper or copper alloy

1995-08-02

1997-12-23

Breneman, R. Bruce

Compositions

Etching or brightening compositions

Inorganic acid containing

216105, 252 794, C23F 300, C23F 100

Patent

active

057003890

ABSTRACT:
An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives, triazine, and triazine derivatives, and (d) water. The etching solution exhibits a high etching speed and does not oxidize the copper surfaces after etching.

REFERENCES:
patent: 4130454 (1978-12-01), Dutkewych et al.
patent: 4374744 (1983-02-01), Kawanabe et al.
patent: 4849124 (1989-07-01), Backus
patent: 5066366 (1991-11-01), Lin
patent: 5391395 (1995-02-01), Duchene
"Pyridine derivatives as corrosion inhibitors for copper"; Patel et al.; J. Electrochemical Sci. India; c1975; abstract only; 24(2).
Database WPI, Derwent Publications, AN 72-55037T, JP-A-47 033 185, 1972.

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