Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-11-22
1995-05-30
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
252 791, C09K 1300, H01L 2100
Patent
active
054198089
ABSTRACT:
An etchant includes an organic acid and hydrogen peroxide mixed in a volume ratio of 1:1 to 200:1 with a basic material added to adjust the pH. The etching solution presents an eminent difference in the etching rates between GaAs/AlGaAs, GaAs/InGaAs, AlGaAs/InGaAs, InGaAs/AlGaAs, and InGaAs/GaAs. High selectivity etching is completed easily and with high precision. Precise control of etching of a heterostructure is achieved.
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Dang Thi
Mitsubishi Denki & Kabushiki Kaisha
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