Etching rate determining method and apparatus

Details Etching rate determining method and apparatus Etching rate determining method and apparatus

1992-09-02

1995-02-28

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156664, 156345, C23F 100

Patent

active

053933699

ABSTRACT:
A process and apparatus for monitoring the etching ability of an etchant by accurately measuring the etching rate with a relatively simple arrangement. A process and apparatus for monitoring the etching rate is determined by channeling the etchant from an etching tank to a reaction column, subjecting a specimen of the same material as a metal part to be etched in practice to etching with the etchant in the reaction column, collecting hydrogen gas generated during etching of the specimen, measuring the time taken until a predetermined quantity of hydrogen gas is generated, and computing the etching rate from the measured time.

REFERENCES:
patent: 2180798 (1939-11-01), Collins
patent: 2827724 (1958-03-01), Edds
patent: 3503817 (1970-03-01), Radimer
patent: 4137047 (1979-01-01), Kim
patent: 4388276 (1983-06-01), Konstantouros et al.
Derwent Publication Abstract No. 87-191208/27 (Nov. 1986).
Derwent Publication Abstract No. 08876 (Feb. 1982).
Derwent Publication Abstract No. 88-073475 (Feb. 1988).
Derwent Publication Abstract No. 89-247108 (Nov. 1988).
Derwent Publication Abstract No. 92-231487 (May 1992).

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