Etching process for improving the strength of a laser-machined s

Details Etching process for improving the strength of a laser-machined s Etching process for improving the strength of a laser-machined s

1989-09-29

1991-06-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156654, 156663, 65 31, 134 3, 252 792, B44C 122, C03C 1500, C03C 2506

Patent

active

050229575

ABSTRACT:
A process for improving the strength of laser-machined articles formed of a silicon-based ceramic material such as silicon nitride, in which the laser-machined surface is immersed in an etching solution of hydrofluoric acid and nitric acid for a duration sufficient to remove substantially all of a silicon film residue on the surface but insufficient to allow the solution to unduly attack the grain boundaries of the underlying silicon nitride substrate. This effectively removes the silicon film as a source of cracks that otherwise could propagate downwardly into the silicon nitride substrate and significantly reduce its strength.

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Yamamoto, Junichi, Yamamoto, Yoshifumi, "Laser Machining of Silicon Nitride," Proceedings of LAMP '87, May, 1987, pp. 297-302.

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