Etching of vacuum metallized indium

Details Etching of vacuum metallized indium Etching of vacuum metallized indium

1987-04-16

1987-12-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156664, 156668, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

047131438

ABSTRACT:
A plastic object is manufactured by a process including vacuum metallizing with a corrosion prone metal, namely indium, a dielectric substrate to form "islands" of the indium top coated with a clear resinous layer which encapsulates and insulates the islands, one from another. The indium islands are less than one thousand angstroms thick and have an average diameter of less than three thousand angstroms. The island structure is etched following the growth of the metal as it is deposited between the nucleation stage and the stage of channelization of formation of an electrically conductive film. The etchant is selected to clear channels between island structures to improve adhesion of a dielectric resinous top coat to the dielectric substrate by order of magnitude to adhesion to the islands.
A preferred application of this invention is the manufacture of exterior automobile trim components the base structure of which is a flexible elastomer such as a thermoplastic urethane.

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