Etching of silicon dioxide selectively to silicon nitride and po

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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1566431, 1566461, 437225, H01L 2100

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active

055058167

ABSTRACT:
Silicon dioxide on a substrate is directionally etched using a hydrogen halide plasma which is created within an etch chamber. The method selectively etches silicon dioxide relative to polysilicon and silicon nitride. A substrate and the combination of NH.sub.3 and NF.sub.3 gases or the combination of CF.sub.4 and O.sub.2 gases mixed with H.sub.2 and N.sub.2 gases are located within an etch chamber. An electrical field is created within the etch chamber causing the gas mixture to form a plasma. The negative charge at the bottom of the chamber attracts the positively charged plasma, thereby etching the substrate in the downward direction. The result is an anisotropic product. The method is also shown to be effective in non-selectively etching thermal and deposited oxides, resulting in a similar etch rate for the different types of oxides.

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"Plasma Chemical Aspects of Magnetron Ion Etching with CF.sub.4 /O.sub.2 and CF.sub.4 /H.sub.2.sup.h "; Plasma Processing and Synthesis of Materials; Material Research Soc; XVL; 1987; abstract only; Bright et al.

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