Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-06-04
1989-08-22
Lacey, David L.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156664, 252 794, C23F 100, C23F 118
Patent
active
048592811
ABSTRACT:
A copper etching composition and an improved method for copper etching utilizing the composition, the composition includes an aqueous solution of a strong acid, a stabilized hydrogen peroxide, and an accelerator that can include both tolyltriazole and either an aliphatic water soluble monoalcohol or a glycol monoether in the etchant solution to provide a faster etching rate.
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Anderson Andrew J.
Lacey David L.
Pennwalt Corporation
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