Etching method of forming microcircuit patterns on a printed cir

Details Etching method of forming microcircuit patterns on a printed cir Etching method of forming microcircuit patterns on a printed cir

1991-07-22

1993-01-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 156666, 156345, 156901, B44C 122, C23F 100

Patent

active

051804654

ABSTRACT:
An etching method of forming circuit patterns on a printed circuit board is disclosed. The etching method comprises step of supplying etching solvent with discharge pressure of substantially 5.about.10 kg/cm.sup.2 and discharge particle diameter of 100.about.200 .mu.m.

REFERENCES:
patent: 3935041 (1976-01-01), Goffredo et al.
patent: 4917758 (1990-04-01), Ishizuka et al.
patent: 5071508 (1991-12-01), Scheithauer et al.
Butora et al., "Circuit Etching Process", IBM Technical Disclosure Bulletin, vol. 12, No. 9, Feb. 1970, p. 1515.

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