Etching method, method of producing a semiconductor device, and

Details Etching method, method of producing a semiconductor device, and Etching method, method of producing a semiconductor device, and

1995-04-26

1997-11-18

Baxter, Janet C.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566251, 136244, 136256, 252 791, 252 794, C23F 110, H01L 21306

Patent

active

056883668

ABSTRACT:
A method of etching material as a transparent conductive film, a method of producing a semiconductor device, and an etchant therefor are disclosed. These method and etchant are simple, excellent in etching selectivity, and stable for a long time. The methods include the steps of disposing paste on material wherein the paste includes an etching solution and at least one kind of fine particles. A method of producing a semiconductor device, including the above-described etching steps is also disclosed.

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J53-124978, Oct. 31, 1978, Sato et al, English Translation.

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