Etching method and etching apparatus therefor

Details Etching method and etching apparatus therefor Etching method and etching apparatus therefor

1993-10-18

1994-10-04

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156657, 156662, 156345, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

053523245

ABSTRACT:
Disclosed is an etching method and an apparatus for performing an etching by alternately and repeatedly switching an average thickness of an ion sheath and an average energy of etching ions between two different values. Since the etchant absorption to the surface of an article to be etched and the etching by ions are effectively performed, it is possible to reduce the influence of an aspect ratio on an etching depth, and hence to perform the etching with an equal depth even if the width of the opening is changed.

REFERENCES:
patent: 4705595 (1987-11-01), Okudaira et al.
patent: 4808258 (1989-02-01), Otsubo et al.
patent: 5236549 (1993-08-01), Shirakawa et al.

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