Etching method and apparatus

Details Etching method and apparatus Etching method and apparatus

1984-02-14

1984-10-30

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156345, 356445, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

044798482

ABSTRACT:
The present invention consists in an etching method and apparatus wherein an optical image which is reflected from a region of a dicing stripe pattern on a substrate to-be-etched, such as a semiconductor wafer, is focused by a projecting optical system during selective etching. The focused pattern is converted into an image signal by an image detector, and a change of contrast in the region of the dicing stripe pattern is determined from the image signal. Based on this, an ending time for the etching can be decided from the change of contrast.

REFERENCES:
patent: 4198261 (1980-04-01), Busta et al.

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