Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2005-09-06
2005-09-06
Chen, Kin-Chan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S723000, C438S724000
Reexamination Certificate
active
06939806
ABSTRACT:
The etching method of the present invention for forming a hole having a high aspect ratio in a silicon oxide film formed on a substrate via a silicon nitride film includes the step of performing etching using an etching gas composed of a mixture of Ar gas, O2gas, C5F8gas and CH2F2gas.
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