Etching device, and etching method

Details Etching device, and etching method Etching device, and etching method

1989-04-28

1990-03-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 204298, B44C 122, C03C 1500, C03C 2506, H01L 21306

Patent

active

049080954

ABSTRACT:
An etching device comprising a housing in which etching process is carried out, an electrode system having lower and upper electrodes opposed to each other used to generate plasma between these electrodes, while a semiconductor wafer is being placed on the lower electrode, a lifter system to move the lower electrode up and down, a high-frequency power source for applying current between these electrodes, a holder member located between the lower and upper electrodes to hold the wafer at a certain position between these electrodes, and a gas supply means for supplying reaction gases used to generate plasma, between the lower and upper electrodes.

REFERENCES:
patent: 4526670 (1985-07-01), Hajj
patent: 4661196 (1987-04-01), Hockersmith et al.
patent: 4816638 (1989-03-01), Ukai et al.
patent: 4838978 (1989-06-01), Sekine et al.

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