Etching apparatus for substrates

Details Etching apparatus for substrates Etching apparatus for substrates

2007-03-20

2010-10-05

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C134S151000, C134S902000, C134S154000

Reexamination Certificate

active

07807017

ABSTRACT:
An etching apparatus for substrates includes an etching tank including an etching solution, a cassette having a plurality of substrates mounted therein and which is installed inside the etching tank, a porous plate installed on a lower surface of the cassette and a plurality of discharge sections provided in the porous plate corresponding to the substrates and each of the discharge sections having a plurality of discharge ports. The etching apparatus further includes a plurality of first lines connected to the discharge ports respectively, and supplied with a gas to provide bubbles to the substrates through the discharge ports. The first lines are divided into a plurality of groups, and at least one group is supplied with a gas having a pressure different from a pressure of a gas supplied to other groups.

REFERENCES:
patent: 5817185 (1998-10-01), Shindo et al.
patent: 6199568 (2001-03-01), Arai et al.
patent: 6240938 (2001-06-01), Oshinowo
patent: 6911097 (2005-06-01), Chen et al.
patent: 7243911 (2007-07-01), Abiko et al.
patent: 2005/0097771 (2005-05-01), Yi et al.
patent: 2008/0017313 (2008-01-01), Kim et al.
patent: 64-55828 (1989-03-01), None
patent: 3-38037 (1991-02-01), None
JP1055828—English Abstract corresponding to JP64-55828.
JP3038037—English Abstract corresponding to JP3-38037.

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