Etching apparatus and method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156647, 156657, 1566591, 156662, 156345, 252 795, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

048407011

ABSTRACT:
An etching apparatus for the selective etching of e.g. single crystal silicon is described. The apparatus includes a tank for receiving a quantity of liquid etchant, the tank being provided with means for injecting oxygen, nitrogen or mixtures thereof into the etchant. Stirrers circulate the etchant around the bath. Gas injection has been found to improve the quality of the etched product and to provide control of the etching process.

REFERENCES:
patent: 3912563 (1975-10-01), Tomioka et al.
patent: 4251317 (1981-02-01), Foote
patent: 4302273 (1981-11-01), Howard
patent: 4675067 (1987-06-01), Valley

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