Etching aluminum and its alloys using HC1, C1-containing etchant

Fishing – trapping – and vermin destroying

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156643, 156646, 156665, H01L 21283

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active

053875567

ABSTRACT:
A process for etching aluminum from a substrate, where portions of the aluminum are protected by a resist material, is described. The substrate is placed into a chamber and a process gas comprising HCl, Cl-containing etchant and N.sub.2 is introduced in the chamber. A plasma is generated in the chamber to generate from the process gas an etch gas that etches aluminum from the substrate at fast rates, with good selectivity, reduced profile microloading, and substantially only anisotropic etching.

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Grewal et al., Aluminum Etchng with TCP Using Hydrogen Chloride and Chlorine Chemistries. SemiCon West Technical Symposium, Jun. 1992.
Rhoades, Advanced Aluminum Etching in the Precision 5000.TM. Mark II Aluminum Etch System, ACET in Review, Winter, 1992, Applied Materials, Inc.

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