Etching a layer over a semiconductor

Details Etching a layer over a semiconductor Etching a layer over a semiconductor

1985-06-13

1986-06-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29571, 29580, 156653, 1566591, 204 351, 430317, B44C 122, C03C 1500, C03C 2506

Patent

active

045966273

ABSTRACT:
A new phenomenon in integrated circuit etch processing is presented, explained and utilized to permit better removal of layers overlying integrated circuit structures, and if desired, the formation of conductive layers on such structures by a less complicated and lower temperature process than has been possible by conventional techniques.

REFERENCES:
patent: 3438873 (1969-04-01), Schmidt

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