Etched surface mount islands in a leadframe package

Details Etched surface mount islands in a leadframe package Etched surface mount islands in a leadframe package

2011-08-30

2011-08-30

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S113000, C438S124000, C438S108000, C438S111000, C257S667000, C257SE21506, C257SE23052, C257SE23106

Reexamination Certificate

active

08008132

ABSTRACT:
A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

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patent: 2008/0290486 (2008-11-01), Chen et al.
patent: 2010/0255640 (2010-10-01), Yu et al.
patent: 2004228160 (2004-08-01), None
patent: 2005109007 (2005-04-01), None

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