Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-11-14
1984-07-31
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566591, 156666, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
044628617
ABSTRACT:
A process for etching copper comprising contact of the copper with an etchant that is an aqueous solution of sulfuric acid, a peroxide and a low molecular weight carboxylic acid. The low molecular weight carboxylic acid in the etchant exalts etch rate.
REFERENCES:
patent: 3537895 (1970-11-01), Lancy
patent: 4040863 (1977-08-01), Kitamura
Powell William A.
Shipley Company Inc.
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