Etchant with increased etch rate

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

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Details

Other Related Categories

1566591, 156666, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Type

Patent

Status

active

Patent number

044628617

Description

ABSTRACT:
A process for etching copper comprising contact of the copper with an etchant that is an aqueous solution of sulfuric acid, a peroxide and a low molecular weight carboxylic acid. The low molecular weight carboxylic acid in the etchant exalts etch rate.

REFERENCES:
patent: 3537895 (1970-11-01), Lancy
patent: 4040863 (1977-08-01), Kitamura

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