Etching a substrate: processes – Nongaseous phase etching of substrate – Recycling – regenerating – or rejunevating etchant
Reexamination Certificate
2004-07-22
2008-10-07
Norton, Nadine (Department: 1792)
Etching a substrate: processes
Nongaseous phase etching of substrate
Recycling, regenerating, or rejunevating etchant
C216S092000, C216S105000, C438S692000, C438S745000, C438S754000, C438S748000, C252S079100
Reexamination Certificate
active
07431861
ABSTRACT:
An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.
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Ono et al. Microetching Agent for Copper and Copper Alloy and Surface Treating Method Using the Same, Mar. 31, 1999, Machine translation of JP 2000282265 A into English, 10 pages.
Kuroda Ai
Morinaga Yukari
Teshima Takahiro
Toda Kenji
Angadi Maki
Hamre Schumann Mueller & Larson P.C.
Mec Company Ltd.
Norton Nadine
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