Etchant for polyimides

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156655, 252 795, B29C 1708

Patent

active

040393712

ABSTRACT:
A composition for etching polyimide based polymers comprised of a tetraalkyl ammonium hydroxide and an organic acid selected from the group of acetic acid, tartaric acid and oxalic acid.
The etchant may be used to texture polyimide films or form perforations through polyimide substrates or layers, particularly in the fabrication of printed circuits and semiconductor devices where via holes are required for interconnection of circuitry.

REFERENCES:
patent: 2374213 (1945-04-01), Katzman
patent: 3702285 (1972-11-01), Knorre et al.
patent: 3770528 (1973-11-01), Hermes
patent: 3773463 (1973-11-01), Cohen et al.
patent: 3775316 (1973-11-01), Berg et al.
patent: 3871730 (1975-03-01), Fish
patent: 3958059 (1976-05-01), Diehl

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Etchant for polyimides does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etchant for polyimides, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etchant for polyimides will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2296934

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.