Etchant and process

Details Etchant and process Etchant and process

1977-09-30

1979-03-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 156901, 156904, 252 792, 252 794, C23F 102

Patent

active

041441192

ABSTRACT:
This invention is directed to an etchant and to a process for its use. The etchant comprises sulfuric acid activated with hydrogen peroxide or the synergistic combination of hydrogen peroxide and molybdenum. The etchant is characterized by a source of phosphate ions as an inhibitor against attack on tin, especially immersion tin, as well as several other metals such as nickel and alloys of nickel such as gold alloys. The etchant is especially useful for etching copper and its alloys in the presence of a tin etch resist, and therefore, provides a new procedure for the fabrication of printed circuit boards using immersion tin as an etch resist.

REFERENCES:
patent: 3567533 (1971-03-01), Chiang et al.
patent: 3589004 (1971-06-01), Shaheem
patent: 3690943 (1972-09-01), Papiano

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