Etchant

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

1566591, 156902, 252 792, 252 794, 427 96, 427309, C23F 100, B44C 122

Patent

active

044191839

ABSTRACT:
An etchant, especially for copper, comprising sulfuric acid and hydrogen peroxide and characterized by the inclusion of a small amount of tungsten in an amount sufficient to increase the surface area of the etched metal.

REFERENCES:
patent: 3650959 (1972-03-01), Shipley et al.
patent: 4144119 (1979-03-01), Dutkewych et al.
Hydrogen Peroxide, W. C. Schumb et al., Reinhold Publishing Corporation, New York, NY. pp. 467-469 & pp. 496-498, 1965.

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