Etch thinning techniques for wafer-to-wafer vertical stacks

Details Etch thinning techniques for wafer-to-wafer vertical stacks Etch thinning techniques for wafer-to-wafer vertical stacks

2005-06-21

2005-06-21

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

C216S002000, C216S020000, C216S083000

Reexamination Certificate

active

06908565

ABSTRACT:
Methods for thinning wafer-to-wafer vertical stacks in the fabrication of stacked microelectronic devices. The methods include etching away unsupported portions of a wafer to be thinned in the vertical stack. The removal of the unsupported portions substantially eliminates potential cracking and chipping of the wafer, which can occur during the thinning process when the unsupported portions exist.

REFERENCES:
patent: 5869386 (1999-02-01), Hamajima et al.
patent: 5918139 (1999-06-01), Mitani et al.

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