Etch stop layer formed within a multi-layered gate conductor to

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257411, 257412, 257486, 257740, 257758, 257760, H01L 2976

Patent

active

061112984

ABSTRACT:
A process is provided for forming a transistor gate conductor having an etch stop arranged at a depth below its upper surface such that the lateral width of the gate conductor above the etch stop may be exclusively narrowed to provide for reduction of transistor channel length. A masking layer, i.e., photoresist, patterned above the gate conductor is isotropically etched so as to minimize its lateral width prior to etching the gate conductor. Portions of the gate conductor not protected by the photoresist may be etched from above the etch stop to define a new pair of opposed sidewall surfaces for the upper portion of the gate conductor. The lateral width of the upper portion of the gate conductor thus may be reduced to a smaller dimension than that of conventional gate conductors. The gate conductor is subjected to an anisotropic etch in which portions of the gate conductor not protected by the narrowed photoresist are etched down to the etch stop. The presence of the etch stop ensures that substantial portions of the etch stop and underlying portions of the gate conductor are not removed before etching is completely terminated. As a result, a lower portion of the multi-layered gate conductor is wider than an upper portion of the gate conductor.

REFERENCES:
patent: 5158903 (1992-10-01), Hori et al.
patent: 5600165 (1997-02-01), Tsukamoto et al.
patent: 5710438 (1998-01-01), Oda et al.
patent: 5751048 (1998-05-01), Lee et al.
patent: 5780891 (1998-07-01), Kauffman et al.
patent: 5852319 (1998-12-01), Kim et al.
patent: 5945719 (1999-08-01), Tsuda
patent: 5962904 (1999-10-01), Hu

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Etch stop layer formed within a multi-layered gate conductor to does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etch stop layer formed within a multi-layered gate conductor to , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etch stop layer formed within a multi-layered gate conductor to will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1252693

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.