Etch singulated semiconductor package

Details Etch singulated semiconductor package Etch singulated semiconductor package

2009-02-04

2010-06-08

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23054, C257SE23051

Reexamination Certificate

active

07732899

ABSTRACT:
In accordance with the present invention, there is provided various methods of simultaneously fabricating a plurality of semiconductor packages (e.g., cavity type semiconductor packages) wherein the singulation process is achieved using etching techniques as opposed to more conventional cutting techniques such as sawing or punching. Such etching techniques are inherently lower in cost and free from many of the defects induced by other cutting techniques.

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