Etch process monitors for buried heterostructures

Details Etch process monitors for buried heterostructures Etch process monitors for buried heterostructures

1985-06-19

1987-03-24

Bashore, S. Leon

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156647, 156649, 156662, 29569L, H01L 21306, H01L 2100

Patent

active

046523332

ABSTRACT:
This invention describes the use of etch process monitors or indicators to improve the reproducibility of etching hourglass shaped mesas for buried heterostructure laser/amplifier structures or integrated optical components in III-V compounds (e.g. GaAs/AlGaAs or InP/InGaAsP).

REFERENCES:
patent: 3833435 (1974-09-01), Logan et al.
patent: 3844858 (1974-11-01), Bean
patent: 4099305 (1978-07-01), Cho et al.
patent: 4257011 (1981-03-01), Nakamura et al.
patent: 4341010 (1982-07-01), Tijburg
patent: 4366569 (1982-12-01), Hirao et al.
patent: 4426702 (1984-01-01), Yamashita et al.
"Localized GaAs Etching with Acidic Hydrogen Peroxide Solts", by Don Shaw, Journal of Electro Chem Society, 4-1981, vol. 128, No. 4, pp. 874,876,878,880.
"Buried Multi-Hetero Structure GaAlAs Laser", Proceedings of 13th Conference on Solid State Devices, Tokyo, 1981, Japanese Journal of App. Physics, vol. 21, (1982), pp. 353-358.
"GaAs-Ga.sub.l-x Al.sub.x As Buried Heterostructure Injection Lasers" Journal of Applied Physics, vol. 45, No. 11, Nov. 1974, pp. 4899-4906.

Affiliated with

Also associated with

Rating

Etch process monitors for buried heterostructures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Etch process monitors for buried heterostructures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Etch process monitors for buried heterostructures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1352134