Etch procedure for aluminum alloy

Details Etch procedure for aluminum alloy Etch procedure for aluminum alloy

1981-10-05

1982-09-14

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156665, 252 795, C23F 100, C23F 102

Patent

active

043494110

ABSTRACT:
A process is described for making devices with aluminum-copper alloy in which the aluminum-copper alloy is etched in a basic solution. This procedure is particularly applicable to memory devices and bubble memory devices containing magnetic material (i.e., permalloy) where acid etches cannot be used. Excellent results are obtained with the basic etching solution. In particular the aluminum-copper alloy is completely removed and etching rates are sufficiently fast for commercial manufacturing operations.

REFERENCES:
patent: 2739883 (1956-03-01), Newman
patent: 3356550 (1967-12-01), Stiffler et al.
patent: 3725309 (1973-04-01), Ames et al.

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