Equipment for communication system and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S009000

Reexamination Certificate

active

06940127

ABSTRACT:
Equipment for a communication system has a semiconductor device formed by integrating a Schottky diode, a MOSFET, a capacitor, and an inductor in a SiC substrate. The SiC substrate has a first multilayer portion and a second multilayer portion provided upwardly in this order. The first multilayer portion is composed of δ-doped layers each containing an n-type impurity (nitrogen) at a high concentration and undoped layers which are alternately stacked. The second multilayer portion is composed of δ-doped layers each containing a p-type impurity (aluminum) at a high concentration and undoped layers which are alternately stacked. Carriers in the δ-doped layers spread out extensively to the undoped layers. Because of a low impurity concentration in each of the undoped layers, scattering by impurity ions is reduced so that a low resistance and a high breakdown voltage are obtained.

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Wen-Chau et al.; “Application of δ-doped Wide-Gap Collector Structure for High-Breakdown and Low-Offset voltage Transistors”; American Institute of Physics; Sep. 7, 1998.
Asen Asenov et al.; “Suppression of Random Dopant-Induced Threshold Voltage Fluctuations in Sub-0.1 -μm MOSFET's with Epitaxial and δ-Doped Channels”; IEEE Transaction on Electron Devices; vol. 46, No. 8; Aug. 1999.

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