Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2006-12-29
2010-02-23
Feely, Michael J (Department: 1796)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S787000, C257S788000, C257S789000, C257S795000, C428S413000, C523S440000, C523S443000, C523S456000, C523S461000, C523S466000
Reexamination Certificate
active
07667339
ABSTRACT:
An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof,wherein each of R1through R7, independently, represents a hydrogen atom or a C1-C12hydrocarbon group, provided that when R1through R7are C1-C12hydrocarbon groups, R1and R2, R2and R3, R3and R4, R4and R5, R5and R6, and R6and R7can be joined to each other to form a cyclic structure.
REFERENCES:
patent: 4624912 (1986-11-01), Zweifel et al.
patent: 4631306 (1986-12-01), Markert et al.
patent: 5541000 (1996-07-01), Hardy et al.
patent: 05-156126 (1993-06-01), None
patent: 6-271653 (1994-09-01), None
patent: 6-322073 (1994-11-01), None
patent: 6-326220 (1994-11-01), None
Derwent abstract of JP 05-156126.
Machine translation of JP 05-156126, provided by the JPO website.
Ryu, Je Hong, et al., Latent Catalyst Effects in Halogen-Free Epoxy.
Ryu, Je Hong, et al., “Latent Catalyst Effects in Halogen-Free Epoxy Molding Compounds for Semiconductor Encapsulation”, Journal of Applied Polymer Science, vol. 96, pp. 2287-2299 (2005).
Chang Suk Ku
Kim Whan Gun
Lee Eun Jung
Lee Young Kyun
Park Yoon Kok
Cheil Industries Inc.
Feely Michael J
Lee & Morse P.C.
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