Epoxy resin composition for semiconductor encapsulating use,...

Details Epoxy resin composition for semiconductor encapsulating use,... Epoxy resin composition for semiconductor encapsulating use,...

2006-01-12

2009-11-03

Feely, Michael J (Department: 1796)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C257S788000, C257S793000, C257S795000, C428S413000, C523S457000, C523S466000

Reexamination Certificate

active

07612458

ABSTRACT:
There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein the inorganic filler (D) contains a spherical fused silica (d1) which contains: metal or semimetal other than silicon; and/or an inorganic compound comprising the metal or semimetal other than silicon.

REFERENCES:
patent: 6005030 (1999-12-01), Togawa et al.
patent: 6139978 (2000-10-01), Arai et al.
patent: 64-065116 (1989-03-01), None
patent: 08-020673 (1996-01-01), None

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