Epoxy resin composition for packaging a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

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Details

C257S787000, C257S788000, C257S793000, C257S795000, C523S440000, C523S443000

Reexamination Certificate

active

07825528

ABSTRACT:
An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4′-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.

REFERENCES:
patent: 4724172 (1988-02-01), Mosser et al.
patent: 6143423 (2000-11-01), Shiobara et al.
patent: 2006/0214153 (2006-09-01), Ikezawa et al.
patent: 10-2005-0070621 (2005-07-01), None
patent: 10-2005-0070622 (2005-07-01), None
patent: 10-0561569 (2006-03-01), None
patent: 10-0561575 (2006-03-01), None
patent: 10-2006-0074159 (2006-07-01), None
patent: WO 2004090033 (2004-10-01), None
Translation of KR 10-0561575 B1, provided by the KIPO website (2006).
Translation of KR 10-2006-0074159A, provided by the KIPO website (2006).
Translation of KR 10-2005-0070621A, provided by the KIPO website (2005).
Translation of KR 10-2005-0070622A, provided by the KIPO website (2005).
Derwent abstract of KR 10-0561575 B1 (2006).
Machine translation of KR 10-0561569 B1, provided by the KIPO website (2006).
Human translation of KR 10-0561575 B1, provided by the USPTO translations branch (2009).
Ryu, Je Hong, et al., Latent Catalyst Effects in Halogen-Free Epoxy Molding Compounds for Semiconductor Encapsulation:, Journal of Applied Polymer Science, vol. 96, 2287-2295, (2005).

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