Epoxy resin composition for optical semiconductor element...

Details Epoxy resin composition for optical semiconductor element... Epoxy resin composition for optical semiconductor element...

2011-07-26

2011-07-26

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C257S793000, C257S795000

Reexamination Certificate

active

07986050

ABSTRACT:
The present invention relates to an epoxy resin composition for optical semiconductor element encapsulation, the epoxy resin composition including following components (A) to (C):(A) an epoxy resin represented by the following structural formula (1):in which n is a positive number,(B) an epoxy resin except for the epoxy resin represented by the structural formula (1), and(C) a curing agent.

REFERENCES:
patent: 6878448 (2005-04-01), Ishii et al.
patent: 7157313 (2007-01-01), Kuroda
patent: 7906378 (2011-03-01), Itoh
patent: 2005/0069715 (2005-03-01), Hayakawa et al.
patent: 2005/0090044 (2005-04-01), Kayaba et al.
patent: 2006/0154079 (2006-07-01), Nishikawa
patent: 2006/0216520 (2006-09-01), Osada
patent: 2006-93277 (2006-04-01), None

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