Epoxy resin composition for encapsulating optical...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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C257S793000, C523S427000, C525S481000

Reexamination Certificate

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07345102

ABSTRACT:
An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D):(A) an epoxy resin component comprising a novolak type epoxy resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the epoxy resin component,(B) a curing agent component comprising a novolak type phenol resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the curing agent component,(C) an organic phosphorus flame retarder, and(D) a curing catalyst,wherein the content of an organic phosphorus flame retarder as (C) is from 1.5 to 10% by weight based on the total weight of the epoxy resin composition.

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