Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2004-10-15
2008-03-18
Sellers, Robert (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C257S793000, C523S427000, C525S481000
Reexamination Certificate
active
07345102
ABSTRACT:
An epoxy resin composition for encapsulating optical semiconductor element, comprising the following (A) to (D):(A) an epoxy resin component comprising a novolak type epoxy resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the epoxy resin component,(B) a curing agent component comprising a novolak type phenol resin having at least one of the biphenyl skeleton and naphthalene skeleton in one molecule in an amount of from 50 to 100% by weight of the total weight of the curing agent component,(C) an organic phosphorus flame retarder, and(D) a curing catalyst,wherein the content of an organic phosphorus flame retarder as (C) is from 1.5 to 10% by weight based on the total weight of the epoxy resin composition.
REFERENCES:
patent: 6242110 (2001-06-01), Iwasaki et al.
patent: 6783859 (2004-08-01), Osada et al.
patent: 6797750 (2004-09-01), Taniguchi et al.
patent: 6830825 (2004-12-01), Sumiyoshi et al.
patent: 6905768 (2005-06-01), Tada et al.
patent: 7122587 (2006-10-01), Shimoda et al.
patent: 2003/0187107 (2003-10-01), Sumiyoshi et al.
patent: 5-93038 (1993-04-01), None
patent: 9-100337 (1997-04-01), None
patent: 0 915 118 (1999-05-01), None
patent: 2003-138098 (2003-05-01), None
patent: 2005-8835 (2005-01-01), None
patent: 02/090434 (2002-11-01), None
Chemical abstracts registry Nos. 2734-94-3, 1109-01-9 and 15990-54-2 for phosphazine compounds, 1967, three pages.
Patent Abstracts of Japan—2003-138098 (2003), vol. 2003, No. 9.
Patent Abstracts of Japan—2003-268208 (2003), vol. 2003, No. 12.
JP-A-2003-268208, Toshio Shiobara, “Flame Retardant Epoxy Resin Composition for Sealing of Semiconductor and Semiconductor Device”.
JP-A-2003-138098, Daisuke Oka, “Epoxy Resin Composition and Semiconductor Device”.
Ito Hisataka
Ota Shinya
Tada Yuji
Nitto Denko Corporation
Sellers Robert
Sughrue & Mion, PLLC
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