Epitaxial semiconductor structures having reduced stacking...

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

Reexamination Certificate

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C257S076000, C257SE23118, C257SE33005, C257SE21054, C438S105000

Reexamination Certificate

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07601986

ABSTRACT:
Epitaxial silicon carbide layers are fabricated by forming features in a surface of a silicon carbide substrate having an off-axis orientation toward a crystallographic direction. The features include at least one sidewall that is orientated nonparallel (i.e., oblique or perpendicular) to the crystallographic direction. The epitaxial silicon carbide layer is then grown on the surface of the silicon carbide substrate that includes features therein.

REFERENCES:
patent: 4865685 (1989-09-01), Palmour
patent: 4912063 (1990-03-01), Davis et al.
patent: 4912064 (1990-03-01), Kong et al.
patent: 4981551 (1991-01-01), Palmour
patent: 5227034 (1993-07-01), Stein et al.
patent: 5571374 (1996-11-01), Thero et al.
patent: 5679153 (1997-10-01), Dmitriev et al.
patent: 5886360 (1999-03-01), Ochi
patent: 6011279 (2000-01-01), Singh et al.
patent: 6034001 (2000-03-01), Shor et al.
patent: 6297522 (2001-10-01), Kordina et al.
patent: 6452228 (2002-09-01), Okuno et al.
patent: 6569250 (2003-05-01), Paisley et al.
patent: 6641938 (2003-11-01), Landini et al.
patent: 6649497 (2003-11-01), Ring
patent: 6853006 (2005-02-01), Katoaka et al.
patent: 6995396 (2006-02-01), Takahashi et al.
patent: 7018554 (2006-03-01), Sumakeris
patent: 7109521 (2006-09-01), Hallin et al.
patent: 7230274 (2007-06-01), O'Loughlin et al.
patent: 2003/0042538 (2003-03-01), Kumar et al.
patent: 2003/0068582 (2003-04-01), Komada et al.
patent: 2003/0079689 (2003-05-01), Sumakeris et al.
patent: 2003/0080842 (2003-05-01), Sumakeris et al.
patent: 2003/0188687 (2003-10-01), Paisley et al.
patent: 2004/0183079 (2004-09-01), Kaneko et al.
patent: 2005/0116234 (2005-06-01), Sumakeris et al.
patent: 2005/0118746 (2005-06-01), Sumakeris et al.
patent: 1254442 (2000-05-01), None
patent: 1411050 (2003-04-01), None
patent: 1481030 (2004-03-01), None
patent: 103 34 819 (2004-02-01), None
“Notification of Transmittal of The International Search Report and the Written Opinion of the International Sarching Authority, or the Declaration”, “Written Opinion of the International Searching Authority” and “International Search Report”, PCT/US2005/004473, May 10, 2005.
Nikolaev et al., “SiC liquid-phase epitaxy on patterned substrates”,Journal of Crystal Growth, 166:607-611 (1996).
Nordell et al., “Equilibrium crystal shapes for 6H and 4H SiC grown on non-planar substrates”,Materials Science and Engineering, B61-62:130-134(1999).
Nordell et al., “Homoepitaxy of 6H and 4H SiC on nonplanar substrates”,Appl. Phys. Lett., 72(2):197-199 (1998).
Richter et al., “Rapid plasma etching of cubit SiC using NF3/O2gas mixtures”,Materials Science and Engineering, 846:160-163 (1997).
“Notification of Transmittal of The International Search Report and the Written Opinion of the International Searching Authority, or the Declaration”, “Written Opinion of the International Searching Authority” and “International Search Report”, PCT/US2005/004480, Oct. 7, 2005.
Sumakeris et al.,Methods and Apparatus for Controlling Formation of Deposits in a Deposition System and Deposition Systems and Methods including the Same, U.S. Appl. No. 10/414,787, filed Apr. 16, 2003.
Sumakeris,Method to Reduce Stacking Fault Nucleation Sites and Reduce Forward Voltage Drift in Bipolar Devices, U.S. Appl. No. 10/605,312, filed Sep. 22, 2003.
Nordell et al., “Equilibrium crystal shapes for 6H and 4H SiC grown on non-planar substrates”Materials Science and EngineeringB61-62:130-134 (1999).
Chinese Office Action with English translation, Chinese Application No. 2005800086374, Sep. 14, 2007.

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