Epitaxial metal-insulator-metal-semiconductor structures

Metal treatment – Barrier layer stock material – p-n type – With contiguous layers of different semiconductive material

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148 335, 437105, 437108, 437132, H01L 2906

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055296408

ABSTRACT:
In one form of the invention, a method for the growth of an epitaxial insulator-metal structure on a semiconductor surface comprising the steps of maintaining the semiconductor surface at a pressure below approximately 1.times.10.sup.-7 mbar, maintaining the semiconductor surface at a substantially fixed first temperature between approximately 25.degree. C. and 400.degree. C., depositing an epitaxial metal layer on the semiconductor surface, adjusting the semiconductor surface to a substantially fixed second temperature between approximately 25.degree. C. and 200.degree. C., starting a deposition of epitaxial CaF.sub.2 on the first metal layer, ramping the second temperature to a third substantially fixed temperature between 200.degree. C. and 500.degree. C. over a time period, maintaining the third temperature until the epitaxial CaF.sub.2 has deposited to a desired thickness, and stopping the deposition of epitaxial CaF.sub.2 on the first metal layer.

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Fathauer, et al., "Heteroepitaxy of Insulator/Metal/Silicon Structures: CaF.sub.2 /NiSi.sub.2 /Si(111) and CaF.sub.2 /CoSi.sub.2 /Si(111)", Appl. Phys. Lett., vol. 49, No. 2, Jul. 14, 1986, pp. 64-66.
Phillips, et al., "Using Rapid Thermal Annealing to Improve Epitaxial CaF.sub.2 /CoSi.sub.2 /Si(111) Structures", Mat. Res. Soc. Symp. Proc., vol. 67, 1986, pp. 115-118.
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