Envelope apparatus for localized vacuum processing

Radiant energy – Inspection of solids or liquids by charged particles – Analyte supports

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2504922, 219121EN, 219121EQ, H01J 3718, H01J 3302

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active

045844798

ABSTRACT:
An envelope apparatus is provided for facilitating the production of a vacuum at a localized region on the surface of an article such as a semiconductor wafer. The vacuum permits vacuum processing in the localized region. The envelope apparatus includes an internal processing zone in which the requisite processing level vacuum is maintained. The envelope apparatus also includes intermediate vacuum zones surrounding the internal processing zone. The internal processing zone and surrounding intermediate vacuum zones are exposed at an external surface so that when the external surface is placed in spaced apart, close coupled opposition to the article being processed a graded vacuum seal is formed. The graded seal extends from the internal processing zone, past the intermediate vacuum zones and out to ambient. The envelope apparatus is held either in a fixed position with respect to the surface of the article or actively tracks the topography of the surface of the article so that the gap between the external surface and the surface of the article lies within an acceptable range. For semiconductor processing applications, it has been found that a graded seal formed by two-stage differential pumping and having a gap in the range of 20 micrometers to 40 micrometers will permit vacuums on the order of 10.sup.-5 Torr to be maintained within the interior processing zone of the envelope apparatus.

REFERENCES:
patent: 3156811 (1964-11-01), Barry
patent: 3388235 (1968-06-01), Pinsley et al.
patent: 3426173 (1969-02-01), Steigerwald
patent: 3504371 (1970-03-01), Reeds, Jr.
patent: 4191385 (1980-03-01), Fox et al.
patent: 4342900 (1982-08-01), Susei et al.
patent: 4358657 (1982-11-01), Steigerwald et al.
patent: 4393295 (1983-07-01), Beisswenger et al.
Lewis et al., "A Laser Interferometer Controlled X, Y Air Bearing for Direct Wafer Exposure Electron Beam Lithography," Proc. 10th Int. Conf. on Electron and Ion Beam Science and Technology, p. 477 (1982).
Fox, "Planar Vacuum Seal for Isolating an Air Bearing," U.S. Ser. No. 107,207, filed Dec. 26, 1979 (Corresponding PCT Application No. US80/01718), published Jul. 8, 1982.

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