Enhancing step coverage by creating a tapered profile through th

Details Enhancing step coverage by creating a tapered profile through th Enhancing step coverage by creating a tapered profile through th

1992-12-31

1994-05-03

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156651, 1566591, 437947, 437981, H01L 2131, H01L 21312

Patent

active

053084152

ABSTRACT:
A new method of forming contact or via openings is achieved. A photoresist layer is formed and patterned top of layers of insulating materials overlying a semiconductor substrate. An isotropic etch is performed etching both vertically and horizontally a portion of the insulating layers. The photoresist is pulled back via a pure isotropic etch. Since the resist is being etched threedimensionally, an overhang resist profile is formed at the top of the opening. The opening is completed by anisotropically etching the remainder of the contact or via opening. The overhang part of the resist is recessed back gradually during etching. The oxide is exposed gradually through and together with the resist recessing back. The step formed after the first isotropic etch will be exposed to the anisotropic etch and will be etched into a slope.

REFERENCES:
patent: 4372034 (1983-02-01), Bohr
patent: 4523976 (1985-06-01), Bukhman
patent: 4764245 (1988-08-01), Grewal
patent: 4814041 (1989-03-01), Auda
patent: 4824767 (1989-04-01), Chambers et al.
patent: 4832788 (1989-05-01), Nemiroff
patent: 4902377 (1990-02-01), Berglund et al.
patent: 4908333 (1990-03-01), Shimokawa
patent: 4980316 (1990-12-01), Huebner

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