Enhancement of ultraviolet laser ablation and etching organic so

Details Enhancement of ultraviolet laser ablation and etching organic so Enhancement of ultraviolet laser ablation and etching organic so

1989-07-17

1990-05-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156654, 156668, 21912169, 21912176, B44C 122, B29C 3700

Patent

active

049255231

ABSTRACT:
A method and apparatus are described which enhance the ablative effect of a UV laser. The ablative effect of a pulsed UV laser is enhanced using a second, longer wavelength pulsed laser. Each pulse of the first laser is followed by or combined with a pulse from the second laser. The etch depth per pulse is controlled by varying the time between pulses from the first and second lasers. The maximum etch depth per pulse occurs at a time separation which is a function of the substrate being etched. The first laser wavelength is selected to be within the absorption spectrum of the unexcited surface molecules of the substrate, while the wavelength of the second laser is selected to be within the absorption spectrum of the surface molecules excited by the incident radiation of the first laser.

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