Enhancement of P-type metal-oxide-semiconductor field effect...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate

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C257S192000

Reexamination Certificate

active

06916727

ABSTRACT:
A structure includes a tensile strained layer disposed over a substrate, the tensile strained layer having a first thickness. A compressed layer is disposed between the tensile strained layer and the substrate, the compressed layer having a second thickness. The first and second thicknesses are selected to define a first carrier mobility in the tensile strained layer and a second carrier mobility in the compressed layer.

REFERENCES:
patent: 4710788 (1987-12-01), Dämbkes et al.
patent: 4920076 (1990-04-01), Holland et al.
patent: 4990979 (1991-02-01), Otto
patent: 5241197 (1993-08-01), Murakami et al.
patent: 5291439 (1994-03-01), Kauffmann et al.
patent: 5312766 (1994-05-01), Aronowitz et al.
patent: 5327375 (1994-07-01), Harari
patent: 5442205 (1995-08-01), Brasen et al.
patent: 5461243 (1995-10-01), Ek et al.
patent: 5523592 (1996-06-01), Nakagawa et al.
patent: 5534713 (1996-07-01), Ismail et al.
patent: 5596527 (1997-01-01), Tomioka et al.
patent: 5617351 (1997-04-01), Bertin et al.
patent: 5683934 (1997-11-01), Candelaria
patent: 5739567 (1998-04-01), Wong
patent: 5777347 (1998-07-01), Bartelink
patent: 5780922 (1998-07-01), Mishra et al.
patent: 5786612 (1998-07-01), Otani et al.
patent: 5792679 (1998-08-01), Nakato
patent: 5808344 (1998-09-01), Ismail et al.
patent: 5847419 (1998-12-01), Imai et al.
patent: 5891769 (1999-04-01), Liaw et al.
patent: 5906951 (1999-05-01), Chu et al.
patent: 5963817 (1999-10-01), Chu et al.
patent: 5986287 (1999-11-01), Eberl et al.
patent: 5998807 (1999-12-01), Lustig et al.
patent: 6013134 (2000-01-01), Chu et al.
patent: 6058044 (2000-05-01), Sugiura et al.
patent: 6059895 (2000-05-01), Chu et al.
patent: 6096590 (2000-08-01), Chan et al.
patent: 6107653 (2000-08-01), Fitzgerald
patent: 6111267 (2000-08-01), Fischer et al.
patent: 6117750 (2000-09-01), Bensahel et al.
patent: 6130453 (2000-10-01), Mei et al.
patent: 6143636 (2000-11-01), Forbes et al.
patent: 6204529 (2001-03-01), Lung et al.
patent: 6207977 (2001-03-01), Augusto
patent: 6249022 (2001-06-01), Lin et al.
patent: 6251755 (2001-06-01), Furukawa et al.
patent: 6266278 (2001-07-01), Harari et al.
patent: 6339232 (2002-01-01), Takagi
patent: 6350993 (2002-02-01), Chu et al.
patent: 6399970 (2002-06-01), Kubo et al.
patent: 6498359 (2002-12-01), Schmidt et al.
patent: 6555839 (2003-04-01), Fitzgerold
patent: 6583437 (2003-06-01), Mizuno et al.
patent: 6593191 (2003-07-01), Fitzgerald
patent: 6593641 (2003-07-01), Fitzgerald
patent: 6600170 (2003-07-01), Xiang
patent: 6649480 (2003-11-01), Fitzgerald et al.
patent: 2001/0003364 (2001-06-01), Sugawara et al.
patent: 2002/0100942 (2002-08-01), Fitzgerald et al.
patent: 2002/0125471 (2002-09-01), Fitzgerald et al.
patent: 2002/0125497 (2002-09-01), Fitzgerald
patent: 2002/0140031 (2002-10-01), Rim
patent: 2003/0052334 (2003-03-01), Lee et al.
patent: 41 01 167 (1992-07-01), None
patent: 0 683 522 (1995-11-01), None
patent: 0 829 908 (1998-03-01), None
patent: 0 838 858 (1998-04-01), None
patent: 0 844 651 (1998-05-01), None
patent: 1 020 900 (2000-07-01), None
patent: 1 174 928 (2002-01-01), None
patent: 63122176 (1988-05-01), None
patent: 4-307974 (1992-10-01), None
patent: 7-106446 (1995-04-01), None
patent: 11-233744 (1999-08-01), None
patent: 2001319935 (2000-05-01), None
patent: 02241195 (2002-08-01), None
patent: WO 98/59365 (1998-12-01), None
patent: WO 99/53539 (1999-10-01), None
patent: WO 00/54338 (2000-09-01), None
patent: WO 01/54202 (2001-07-01), None
patent: WO 01/9338 (2001-12-01), None
patent: WO 01/99169 (2001-12-01), None
patent: WO 02/13262 (2002-02-01), None
patent: WO 02/15244 (2002-02-01), None
patent: WO 02/47168 (2002-06-01), None
patent: WO 02/071488 (2002-09-01), None
patent: WO 02/071491 (2002-09-01), None
patent: WO 02/071495 (2002-09-01), None
Eaglesham et al., “Dislocation-Free Stranski-Krastanow Growth of Ge on Si(100),”Physical Review Letters,vol. 64, No. 16 (Apr. 16, 1999) pp. 1943-1946.
Fitzgerald et al., “Totally Relaxed GexSil-xlayers with low threading dislocation densities grown on Si substrates,”Applied Physics Letters,vol. 59, No. 7 (Aug. 12, 1991) pp. 811-813.
Fitzgerald et al., “Related GexSil-xstructures for III-V integration with Si and high mobility two-dimensional electron gases in Si,”J. Vac. Sci. Technol. B,vol. 10, No. 4 (Jul./Aug. 1992) pp. 1807-1819.
Xie et al., “Very high mobility two-dimensional hole gas in Si/GexSil-x/Ge structures grown by molecular beam eiptaxy,”Appl. Phys. Lett.,vol. 63, No. 16 (Oct. 18, 1993) pp. 2263-2264.
Wesler et al., “Electron Mobility Enhancement in Strained-Si N-Type Metal-Oxide-Semiconductor Field-Effect Transistors,”IEEE Electron Device Letters,vol. 15, No. 3 (Mar. 1994) pp. 100-102.
Ismail et al., “Modulation-doped n-type Si/SiGe with inverted interface,”Appl. Phys. Lett.,vol. 65, No. 10 (Sep. 5, 1994) pp. 1248-1250.
Xie et al., “Semiconductor Surface Roughness: Dependence on Sign and Magnitude of Bulk Strain,”The Physical Review Letters,vol. 73, No. 22 (Nov. 28, 1994) pp. 3006-3009.
Bouillon et al., “Search for the optimal channel architecture for 0.18/0.12 μm bulk CMOS Experimental study,”IEEE(1996) pp. 21.2.1-21.2.4.
Kearney et al., “The effect of alloy scattering on the mobility of holes in a Sil-xGexquantum well,”Semicond. Sci Technol.,vol. 13 (1998) pp. 174-180.
Höck et al., “High performance 0.25 μm p-type Ge/SiGe MODFETs,”Electronics Letters,vol. 34, No. 19 (Sep. 17, 1998) pp. 1888-1889.
Bufler et al., “Hole transport in strained Sil-xGexalloys on Sil-yGey substrates,”Journal of Applied Physics,vol. 84, No. 10 (Nov. 15, 1998) pp. 5597-5602.
Fitzgerald et al., “Dislocation dynamics in relaxed graded composition semiconductors,”Materials Science and Engineering B67(1999) pp. 53-61.
Fischetti, “Long-range Coulomb interactions in small Si devices. Part II. Effective electronmobility in thin-oxide structures,”Journal of Applied Physics,vol. 89, No. 2 (Jan. 15, 2001) pp. 1232-1250.
Cheng et al., “Electron Mobility Enhancement in Strained-S in-MOSFETs Fabricated on SiGe-on-Insulator (SGOI) Substrates,”IEEE Electron Device Letters,vol. 22, No. 7 (Jul. 2001) pp. 321-323.
Leitz et al., “Dislocation glide and blocking kinetics in compositionally graded SiGe/Si,”Journal of Applied Physics,vol. 90, No. 6 (Sep. 15, 2001) pp. 2730-2736.
Currie et al., “Carrier mobilities and process stability of strained Si n- and p-MOSFETs on SiGe virtual substrates,”J. Vac. Sci. Technol. B.,vol. 19, No. 6 (Nov./Dec. 2001) pp. 2268-2279.
Ransom et al., “Gate-Self-Aligned n-channel and p-channel Germanium MOSFET's,”IEEE Transactions on Electron Devices,vol. 38, No. 12 (Dec. 1991) pp. 2695.
König et al., “p-Type Ge-Channel MODFET's with High Transconductance Grown on Si Substrates,”IEEE Electron Device Letters,vol. 14, No. 4 (Apr. 1993) pp. 205-207.
Fischetti et al., “Band structure, deformation potentials, and carrier mobility in strained Si, Ge, and SiGe alloys,”J. Appl. Phys.,vol. 80, No. 4 (Aug. 15, 1996) pp. 2234-2252.
Currie et al., “Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing,”Applied Physics Letters,vol. 72 No. 14 (Apr. 6, 1998) pp. 1718-1720.
Reinking et al., “Fabrication of high-mobility Ge p-channel MOSFETs on Si substrates,”Electronics Letters,vol. 35, No. 6 (Mar. 18, 1999) pp. 503-504.
Koester et al., “Extremely High Transconductance Ge/Si0.4Ge0.6p-MODFET's Grown by UHV-CVD,”IEEE Electron Device Letters,vol. 21, No. 3 (Mar. 2000) pp. 110-112.
Carlin et al., “High Efficiency GaAs-on-Si Solar Cells with High VocUsing Graded GeSi Buffers,”IEEE(2000) pp. 1006-1011.
Rosenblad et al., “Virtual Substrates for the n- and p-type Si-MODFET Grown at Very High Rates,”Materials Science and Engineering,vol. B74 (2000) pp. 113-117.
Ueno et al., &#

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