Enhanced step coverage of thin films on patterned substrates...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S758000, C257SE21536, C204S192170

Reexamination Certificate

active

10872083

ABSTRACT:
A method and an apparatus for fabricating an integrated circuit entail directing a vapor flux toward a substrate surface from a plurality of directions associated with a plurality of azimuth angles, and selecting a deposition angle of the vapor flux, relative to a normal incidence, to obtain a substantially conformal film. The surface feature can be associated with, for example, one or more vias and/or one or more trenches.

REFERENCES:
patent: 4944961 (1990-07-01), Lu et al.
patent: 5290358 (1994-03-01), Rubloff et al.
patent: 5885425 (1999-03-01), Hsieh et al.
patent: 6206065 (2001-03-01), Robbie et al.
patent: 6429105 (2002-08-01), Kunikiyo
patent: 6716322 (2004-04-01), Hedge et al.
C.H. Choi et al., “Epitaxial grown of A1(111)/(Si(111) films using partially ionized beam deposition,” 1992 Appl. Phys. Lett. 51 (24), Dec. 14, 1987 American Inst. of Physics., pp. 1992-1994.
B. Gittleman, et al., “Impurity effects in partially ionized beam metal via filling,” J. Vac. Sci. Technol. A 8 (3), May/Jun. 1990 American Vacuum Society, pp. 1514-1520.
T. Karabacak et al., “Growth-frint roughening in amorphous silicon films by sputtering,” Physical Review B. vol. 64, The American Physical Society, pp. 085323-1-085323-6.
S.M. Rossnagel, “Sputter deposition for semiconductor manufacturing,” IBM J. Res. Develop. vol. 43, No. ½ Jan./Mar. 1999 IBM., pp. 163-179.
S.M. Rossnagel, “Directional and ionized physical vapor deposition for microelectronics applications,” J. Vac. Sci. Technol. B 16(5), Sep./Oct. 1998 Am. Vacuum Soc., pp. 2585-2608.
John A. Thornton, “The microstructure of sputter-deposited coatings,” J.Vac.Sci.Technol. A 4(6), Nov./Dec. 1986 American Vacuum Society, pp. 3059-3056.
John A. Thornton, “Structure-Zone Models of Thin Films,” SPIE vol. 821 Modeling of Optical Thin Films (1987), pp. 95-103.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Enhanced step coverage of thin films on patterned substrates... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced step coverage of thin films on patterned substrates..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced step coverage of thin films on patterned substrates... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3749569

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.