Enhanced protection of semiconductors with dual surface seal

Details Enhanced protection of semiconductors with dual surface seal Enhanced protection of semiconductors with dual surface seal

1996-09-13

1999-09-21

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438122, 257704, 257712, H01L 2144

Patent

active

059565764

ABSTRACT:
The present invention relates generally to a new apparatus and method for encapsulating ceramic chip carriers. More particularly, the invention encompasses an apparatus and a method for providing a fluid-tight, non-hermetic seal to a ceramic chip carrier utilizing dual surfaces. This is done by using the corner edges of the chip carrier, i.e., by using not only a minimal amount of the top-surface real estate of the chip carrier, but also the side-walls of the chip carrier to create the dual surface seal. This dual surface seal can be both hermetic and non-hermetic.

REFERENCES:
patent: 4291815 (1981-09-01), Gordon et al.
patent: 4626460 (1986-12-01), Hamano et al.
patent: 4746583 (1988-05-01), Falanga
patent: 4833102 (1989-05-01), Byrne et al.
patent: 4839716 (1989-06-01), Butt
patent: 4999699 (1991-03-01), Christie et al.
patent: 5064782 (1991-11-01), Nishiguchi
patent: 5064968 (1991-11-01), Kovacs et al.
patent: 5258576 (1993-11-01), Neumann et al.
patent: 5414300 (1995-05-01), Tozawa et al.
patent: 5471027 (1995-11-01), Call et al.
patent: 5710459 (1998-01-01), Teng et al.
patent: 5744863 (1998-04-01), Culnane et al.

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