Enhanced plasma etching

Details Enhanced plasma etching Enhanced plasma etching

1987-02-09

1991-01-15

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156668, H01L 2100

Patent

active

049851128

ABSTRACT:
Increased etching rates are obtained by plasma etching wherein the power is applied in a cyclical or oscillating mode.

REFERENCES:
patent: 3677799 (1972-07-01), Hou
patent: 4263088 (1981-04-01), Gorin
patent: 4357195 (1982-11-01), Gorin
patent: 4357203 (1982-11-01), Zelez
patent: 4401507 (1983-08-01), Engle
patent: 4500563 (1985-11-01), Ellenberger et al.
patent: 4568563 (1986-02-01), Jackson et al.
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4585516 (1986-04-01), Corn et al.
patent: 4602981 (1986-07-01), Chem et al.
patent: 4609428 (1986-09-01), Fujimura
patent: 4617079 (1986-10-01), Tracy et al.
patent: 4626315 (1986-12-01), Kitamoto et al.
Boswell, et al., Applied Physics Letters, "Pulsed High Rate Plasma Etching With Variable Si/SiO.sub.2 Selectivity and Variable Si Etch Profiles", 47 (1985) Nov., No. 1o.

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