Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-05
2005-04-05
Zarneke, David A. (Department: 2827)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S764000
Reexamination Certificate
active
06876553
ABSTRACT:
An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
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Chaudhry Imtiaz
Khan Reza-ur Rahman
Zhao Sam Ziqun
Broadcom Corporation
Dinh Tuan
Sterne Kessler Goldstein & Fox P.L.L.C.
Zarneke David A.
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