4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Imtiaz Chaudhry

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Enhanced die-up ball grid array package with two substrates

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Method for assembling a ball grid array package with two...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Method for making an enhanced die-up ball grid array package...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2803571

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