Enhanced collimated sputtering apparatus and its method of use

Details Enhanced collimated sputtering apparatus and its method of use Enhanced collimated sputtering apparatus and its method of use

1998-01-29

2000-03-14

Diamond, Alan

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419213, 2041923, 20419232, 20419223, 20419225, 20429803, 20429809, 20429811, 20429815, 20429825, 20429826, 20429827, 20429828, 20429831, 20429832, 20429835, 20429829, C23C 1434

Patent

active

060368217

ABSTRACT:
A sputtering apparatus using a collimator disposed between a wafer holder for holding a wafer and a target to intercept some of the particles ejected from the target, wherein the collimator is movable in a direction parallel to the wafer surface in a manner permitting the collimator to be cleaned and maintained in situ simultaneous with sputtering deposition processing.

REFERENCES:
patent: 4824544 (1989-04-01), Mikalesen et al.
patent: 4901667 (1990-02-01), Suzuki et al.
patent: 5007372 (1991-04-01), Hattori et al.
patent: 5223108 (1993-06-01), Hurwitt
patent: 5382339 (1995-01-01), Aranovich
patent: 5393398 (1995-02-01), Sugano
patent: 5409587 (1995-04-01), Sandhu et al.
patent: 5505833 (1996-04-01), Werner et al.
patent: 5624536 (1997-04-01), Wada et al.
patent: 5643428 (1997-07-01), Krivokapic et al.

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