Enhanced ceramic ball grid array using in-situ solder stretch wi

Details Enhanced ceramic ball grid array using in-situ solder stretch wi Enhanced ceramic ball grid array using in-situ solder stretch wi

1997-08-12

1999-10-19

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Shaped configuration for melting

428592, 428614, 22818022, 228 563, H01L 2160, B23K 3514

Patent

active

059686707

ABSTRACT:
A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

REFERENCES:
patent: 3509270 (1970-04-01), Dube et al.
patent: 3616532 (1971-11-01), Beck
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3921285 (1975-11-01), Krall
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 5148968 (1992-09-01), Schmidt et al.
patent: 5222014 (1993-06-01), Lin
patent: 5284796 (1994-02-01), Nakanishi et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5441195 (1995-08-01), Tustaniwskyi et al.
patent: 5466635 (1995-11-01), Lynch et al.
patent: 5541450 (1996-07-01), Jones et al.
patent: 5639696 (1997-06-01), Liang et al.
IBM Technical Disclosure Bulletin, Vol. 19, No. 4, Sep. 1976, "Chip Support Assembly", pp. 1178-1179.
IBM Technical Disclosure Bulletin, Vol 27, No. 3, Aug. 1984, "Process for Elongating Semiconductor Device Solder Connections", p. 1579.
IBM Technical Disclosure Bulletin, Vol. 27, No. 10B, Mar. 1985, "Centrifugal Stretching of C4 Joints", pp. 6198-6200.

Affiliated with

Also associated with

Rating

Enhanced ceramic ball grid array using in-situ solder stretch wi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Enhanced ceramic ball grid array using in-situ solder stretch wi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced ceramic ball grid array using in-situ solder stretch wi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2053500